NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
---|---|---|---|---|---|---|
5962-01-319-0513 Item Description: Microcircuit Memory | 5962 | 013190513 | 0 | N | B | |
CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
7 | B | A | 0 | |||
Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
Am27c64-70dc | 5 | 2 | 5 |
MRC | Criteria | Characteristic |
---|---|---|
ABHP | OVERALL LENGTH | 1.280 INCHES MAXIMUM |
ABKW | OVERALL HEIGHT | 0.355 INCHES NOMINAL |
ABMK | OVERALL WIDTH | 0.620 INCHES MAXIMUM |
ADAQ | BODY LENGTH | 1.280 INCHES MAXIMUM |
ADAT | BODY WIDTH | 0.550 INCHES MAXIMUM |
ADAU | BODY HEIGHT | 0.210 INCHES MAXIMUM |
AFGA | OPERATING TEMP RANGE | +0.0 TO 70.0 DEG CELSIUS |
AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
CQZP | INPUT CIRCUIT PATTERN | 11 INPUT |
CZEQ | TIME RATING PER CHACTERISTIC | 70.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 70.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
CZER | MEMORY DEVICE TYPE | ROM |
TTQY | TERMINAL TYPE AND QUANTITY | 24 PRINTED CIRCUIT |
CQSJ | INCLOSURE MATERIAL | CERAMIC AND GLASS |
CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
CBBL | FEATURES PROVIDED | BIPOLAR AND BURN IN AND ERASABLE AND HIGH PERFORMANCE AND HIGH SPEED AND LOW POWER AND PROGRAMMABLE |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS MAXIMUM POWER SOURCE |
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